|
BCP TECHNOLOGIES, INC. |
|
|
BCP TECHNOLOGIES, INC. |
| Date: | RFQ No.: | ||
| Company: | Contact: | ||
| Address: | |||
| Phone: | Fax: | ||
| Email: | Modem: | ||
| Part #: | Board Name: | |||
| Board Size: | Panel Size: | |||
| Material/Thickness: | # of Layers: | |||
| Board Quantity: | Quantity per Relase: | |||
| # of Holes: | Smallest Hole size: | |||
| # of SMT Pads: | SMT # of Sides: | |||
| Min. Line Width: | Min. Track Spacing: | |||
| # of Mask Sides: | # of Legend Sides: | |||
| Copper Thickness Outer Layers: |
Copper Thickness Inner Layers: |
|||
| Hot Air Leveled: | Yes No | Routing: | Yes No | |
| Scoring: | Yes No | Punching: | Yes No | |
| Gold Plating: | Yes No |
| If yes, entire board: | Edge Connectors Only: | Thickness: | |
| If possible, please also fax drawings or modem gerber files to us for more accurate quotation. | |||
| Remarks: |
| ABOUT OUR COMPANY | CAPABILITIES | Home |
|
|
|